Coplanar Waveguide
2010.10.30 Takuichi Hirano
([2])
([2])
(Eq.(4)
in [1])
for finite metallization thickness ([2])
(filling
factor; Eq.(5b) in [1])
where, K(m) is the complete elliptic integral of the first kind.
(Eq.(5a)
in [1])
for finite
metallization thickness ([2])
(Eq.(6) in
[1])
References
- G. Ghione, C.U. Naldi, "Coplanar Waveguides for MMIC Applications:
Effect of Upper Shielding, Conductor Backing, Finite-Extent Ground Planes,
and Line-to-Line Coupling," IEEE Transactions on Microwave Theory and
Techniques, Vol.35, No.3, pp.260-267, March 1987.
- K. C. Gupta, R. Garg, I. J. Bahl, and P. Bhartia, Microstrip Lines and Slotlines,
2nd ed.Artech House, Inc., 1996.
Appendix
Download Mathematica Notebook File: cpw.nb (49KB)
Copyright(c) 2010 Takuichi Hirano
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